Design of Experiment - Doe - With regard to avoid the void™ - Part ii of iii
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This is part two of a three-part series. This video is for anyone interested in the design
of experiment aspect of Avoid the Void™.
Brook, let's talk a little bit about the effect of profile parameters on voiding.
The profile's really important, because if you don't give the solder paste enough time
you're not going to create a good solder joint. If the preheat's too short, you won't allow
time for the volatiles to evolve and for them to escape the solder joint before the solder's
molten and they become entrapped. On the other side, if you don't give enough time above
liquidus, then you don't give enough time for the alloy to wet to all of the surfaces,
and, so, you'll exacerbate that mode of voiding.
Okay, what about the opposite? What if the profile's too long?
If the profile's too long, you run the risk of oxidizing your surfaces and exhausting
your flux, and, therefore, exacerbating the wetting side of the voiding performance.
Brook, you've done a lot of work in this area. Where can we find more information in the
way of papers and videos?
You can find it at www.indium.com or you could contact me directly at bsandy@indium.com.
Brook, thank you so much.
