Wafer Processing - Rokko electronics co., ltd.

It is ROKKO ELECTRONICS Co., Ltd. We can perform washing, polishing, grinding for the silicon, SIC, sapphire. I explain our feature. After having thinned a wafer, we polish it. Furthermore, we finally wash the aspect. It was our feature that could process totally. As a new process this time, we adopted knife edge prevention processing. Now, only washing by the pure water and organic washing by IPA were possible . Therefore it did not get particle pollution and metal pollution. We introduced two devices which could wash RCA only the ground plane. So the processing which the other companies couldn't do was realized. We intrduce a technique of the washing, grounding, washing for difficulty cuts materials such as SIC or the sapphire. Therefore we build the technique for them. The existence process is the method to paste to a batch and grind several wafer called lap. We have a thought for the future when a wafer grows big. For example, I think about 6 inches of correspondence of SIC and the sapphire and develop a whetstone in a normal grinder with a whetstone maker. I build the technique that the big wafer of the diameter grinds equally. The feature is that three processing is possible. We are making the product of a power device, the sensor device. Thank you.